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  Datasheet File OCR Text:
 FDH700
ULTRA FAST DIODE
DISCRETE POWER AND SIGNAL TECHNOLOGIES
Information Only Data Sheet
FINAL REVERSE CURRENT & FORWARD VOLTAGE LIMITS MIGHT BE INCREASED SLIGHTLY
Absolute Maximum Ratings (note 1) Parameter
Storage Temperature Maximum Junction Temperature Total Power Dissipation at 25OC Derate above 25OC Working Inverse Voltage DC Forward Current
0.500 Minimum 12.70 Typ 1.000 CATHODE BAND LOGO FD H7 00 0.022 (0.558) Diameter 0.018 (0.458) Typ 20 mils 0.200 (5.08) 0.120 (3.05)
TA = 25OC unless otherwise noted
Value
-65 to +200 -65 to +175 250 1.67 20 150
Units
O O
C C
mW mW/OC V mA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
0.090 (2.28) Diameter 0.060 (1.53)
Electrical Characteristics SYM BV IR VF
TA = 25OC unless otherwise noted
CHARACTERISTICS Breakdown Voltage Reverse Leakage Forward Voltage
MIN 30
MAX
UNITS V IR
TEST CONDITIONS = 5.0 uA 20 V 20 V TA = 150OC 10 uA 100 uA 1.0 mA 10 mA 20 mA 50 mA
50 50 420 520 640 760 810 0.89 500 610 740 900 990 1.25 900
nA uA mV mV mV mV mV V ps
VR = VR = IF IF IF IF IF IF = = = = = =
TRR CT
Reverse Recovery Time
IF= IR = 10 mA IRR = 1.0 mA RLoop = 100 Ohm VR = 0 V, f = 1.0 MHz
FDH700 - Rev. A
Diode Capacitance
1.5
pF
(c) 1999 Fairchild Semiconductor Corporation
DISCRETE POWER AND SIGNAL TECHNOLOGIES
STANDARD DIGITAL MARKING CRITERIA MAXIMUM CHARACTERS PER LINE: 3 MAXIMUM NUMBER OF LINES: 4 LOGO AND CHARACTERS M & W COUNT AS 2 CHARACTERS EACH
0.021 (0.533) Diameter 0.019 (0.483)
LEADS: COPPER CLAD STEEL TYPICAL 20 Mils LEADS TIN DIPPED (60% SN 40% PB) STUDS: DUMET (ALLOY 42)
GLASS SLEEVE
0.150 (3.810) 0.140 (3.556)
CATHODE BAND
1.105 (28.067) 1.081 (27.457)
0.050 (1.270) Maximum
SEE NOTE 1 BELOW
Package Weight 0.14 grams
0.074 (1.880) Diameter 0.068 (1.727)
NOTE 1: LEAD DIAMETER NOT CONTROLLED IN THIS ZONE TO ALLOW FOR FLASH, LEAD FINISH BUILD-UP, & MINOR IRREGULARITIES OTHER THAN SLUGS.
DO-35 PACKAGE
Fairchild Semiconductor's Criteria
11-MAR-97
FD700
Ultra Fast Diode Diode
DISCRETE POWER AND SIGNAL TECHNOLOGIES
Absolute Maximum Ratings (note 1) Parameter
Storage Temperature Maximum Junction Temperature Total Power Dissipation at 25OC Derate above 25OC Working Inverse Voltage DC Forward Current
TA = 25OC unless otherwise noted
Value
-65 to +200 -65 to +175 250 1.67 20 150
Units
O O
C C
mW mW/OC V mA
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
DO-7 PACKAGE
Electrical Characteristics SYM BV IR VF
TA = 25OC unless otherwise noted
CHARACTERISTICS Breakdown Voltage Reverse Leakage Forward Voltage
MIN 30
MAX
UNITS V IR
TEST CONDITIONS = 5.0 uA 20 V 20 V TA = 150OC 10 uA 100 uA 1.0 mA 10 mA 20 mA 50 mA
50 50 420 520 640 760 810 0.89 500 610 740 880 950 1.10 700
nA uA mV mV mV mV mV V ps
VR = VR = IF IF IF IF IF IF = = = = = =
TRR CT
Reverse Recovery Time
IF= IR = 10 mA IRR = 1.0 mA RLoop = 100 Ohm VR = 0 V, f = 1.0 MHz
Rev. A June 1998
Diode Capacitance
1.0
pF
(c) 1997 Fairchild Semiconductor Corporation
DISCRETE POWER AND SIGNAL TECHNOLOGIES
LEADS:BORATED (ALLOY 42) DUMET TYPICAL 20 mils Diameter LEADS TIN DIPPED (60% SN 40% PB)
0.021 (0.533) Diameter 0.019 (0.483)
Typical Solder Thickness in micro-inches Min Avg Max 125.9 162.1 204.3
GLASS PLUG GLASS SLEEVE
0.287 (7.290) 0.265 (6.731)
"C" BEND SPRING
SOLDER PREFORM Sb/Sn (5% - 10% Sb) BORATED (ALLOY 42) DUMET COMFAB STUDSEAL (FIRST SEAL)
1.110 (28.194) 1.085 (27.559)
0.050 (1.270)
MAXIMUM SEE NOTE 1 BELOW
0.097 (2.464) Diameter 0.093 (2.362)
NOTE 1: LEAD DIAMETER NOT CONTROLLED IN THIS ZONE TO ALLOW FOR FLASH, LEAD FINISH BUILD-UP, & MINOR IRREGULARITIES OTHER THAN SLUGS.
DO-7 PACKAGE
Fairchild Semiconductor's Criteria 13-APR-93
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
DISCLAIMER
FAST FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM
OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM
STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET VCXTM
STAR*POWER is used under license
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. H3


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